Signetics Corp. manufactures and sells various semiconductor packaging equipments, such as Dual Inline Packages (DIL), Plastic Leaded Chip Carriers (PLCC), Quad Flat Packages (QFP), Ball Grid Arrays (BGA), Chip On Glasses (COG), and Memory Cards (M-Cards).

Designation as Temporary Overheated Issue(3 day- Periodic Call Auction Trading)

(Forewarning) Designation as Temporary Overheated Issue(3 day- Periodic Call Auction Trading)

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52-week Range	0.00 - 0.00
Market Cap (USDm)	0.00
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Dividend (Yield)	0.00

Signetics Corp (033170 KS)

Designation as Temporary Overheated Issue(3 day- Periodic Call Auction Trading)

(Forewarning) Designation as Temporary Overheated Issue(3 day- Periodic Call Auction Trading)

Decision on Disposal of Shares or Investment Securities of Other Corporation

Change of CEO

Outcomes of Annual Meeting of Shareholders

Price Gauge

52-week Range

Market Cap (USDm)

P/E

Dividend (Yield)