Bond market data and technology, BondEvalue

BondEvalue

Bond market data and technology

BondEvalue is a Singapore-based Fintech that specializes in bond market data and technology. The company's information services business offers bond market data on hard-currency corporate & sovereign bonds across Asia, Middle East, Europe and the Americas. The data, which includes bond prices, yields, news and analytics, is offered to end investors via interactive Mobile and Web Apps. Investors can sign up for a free trial of the service either via the company's website (https://bondevalue.com) or by downloading the BondEvalue Mobile App (http://onelink.to/wej7jq). BondEvalue is also developing an electronic bond exchange, BondbloX in Singapore that allows investors to trade bonds electronically in smaller sizes (US$1,000 or equivalent). For more information, visit https://www.bondblox.com/

Bond Market Data and Technology

Credit

US markets ended flat with the S&amp;P and Nasdaq down ~0.1%. May data was upbeat on US Manufacturing with the ISM Manufacturing PMI registering a 61.2 print vs. 60.7  in April supported by the opening up of the economy. Energy was up 3.9% while health care was down 1.6%. US 10Y Treasury yields were down 1bp to 1.61%. European markets also continued gains as the Markit Eurozone Manufacturing PMI improved to a new high of 63.1  in May on strong economic recovery. DAX was up ~1%, FTSE was up 0.8% and CAC was up ~0.7%. US IG CDS spreads were 0.6bp tighter and HY spreads were 2.8bp tighter. EU main spreads were 0.7bp tighter and crossover spreads tightened 1.6bp. Asian equities are off to another soft start with Nikkei up 0.2%, Hang Seng and Shanghai down 0.2% and 0.4% respectively with Asia ex-Japan CDS spreads widening 0.5bp.

TML、インドネシア、SMCがドル建て債券を発行、マクロ、格付け変更、新規発行、トーキング・ヘッズ、上昇率上位銘柄...

Asia High Yield Bond Index

TML、インドネシア、SMCがドル建て債券を発行、マクロ、格付け変更、新規発行、トーキング・ヘッズ、上昇率上位銘柄...