Index Rebal/Special Situations, Quiddity Advisors

Janaghan Jeyakumar, CFA

Index Rebal/Special Situations

Quiddity Advisors

Pan-Asia Catalysts/Events

Index Rebalance

Tung Ho Steel Enterprise / Index Rebalance

<ul>
<li>The T50 index represents the top 50 largest stocks by market capitalization in the Taiwan Stock Exchange (TWSE). The T100 index represents the next 100 largest names (51-150 ranks).</li>
<li>In this insight, we take a look at the potential ADDs and DELs for the September 2025 index rebal event.</li>
<li>Currently, we see no changes for T50 and two changes for T100 in September.</li>
</ul>


The T50 index represents the top 50 largest stocks by market capitalization in the Taiwan Stock Exchange (TWSE). The T100 index represents the next 100 largest names (51-150 ranks).
In this insight, we take a look at the potential ADDs and DELs for the September 2025 index rebal event.
Currently, we see no changes for T50 and two changes for T100 in September.


Quiddity Leaderboard T50/​​​100 Sep25: Tung Ho Steel TDIV Deletion Gets Closer than Before

Asia Pac ECM and Index Rebal, Shenton Research

Ke Yan, CFA, FRM

Asia Pac ECM and Index Rebal

Asia Pac IPO & Placement Research, China Biotech

DZT Research

DZT Research is an independent Asia Pacific equity specialist. Our quantitative research covers index rebalancing flows, alongside exchange data analytics accross Asia Pacific. On the equity capital markets side, we focus on Asia Pacific ECM, especially biotech and TMT. Our lead analyst is frequently cited by international media.

Quantitative Analysis

<ul>
<li>We analyzed the changes in short interest of TWSE Stocks as of May 2nd which has an aggregated short interest worth USD21.3bn.</li>
<li>We tabulate league table for top short by value and short as multiple of ADT, as well as weekly increases &amp; decreases in short value, short as multiple of ADT.</li>
<li>We highlight short interest changes in Winbond Electronics, China Motor, Ap Memory Technology.</li>
</ul>


We analyzed the changes in short interest of TWSE Stocks as of May 2nd which has an aggregated short interest worth USD21.3bn.
We tabulate league table for top short by value and short as multiple of ADT, as well as weekly increases &amp; decreases in short value, short as multiple of ADT.
We highlight short interest changes in Winbond Electronics, China Motor, Ap Memory Technology.


TWSE Short Interest Weekly (May 2nd): Winbond Electronics, China Motor, Ap Memory Technology

Managing Director, Zero One, Zero One

Vincent Fernando, CFA

Managing Director, Zero One

Zero One

Founded in 2015, Zero One produces independent investment research and provides corporate finance advisory services with a focus on both listed and private technology companies. Founder Vincent Fernando has over 20 years of experience in US and Asia capital markets.

Independent Investment Research

Equity Bottom-Up

<ul>
<li>Faraday Top-Line Soars on CoWoS Chip Packaging Services Support Ramp -- 78% of MP Revenue Came from AI/HPC Applications</li>
<li>TSMC-Aligned Execution Enables Asset-Light Business Scaling for Faraday -- New Fabless OSAT Service is Highly Differentiated; Competitive Advantage</li>
<li>Outlook: Continued Very Strong Momentum into 2Q25 -- 1H25 Revenue Will Be Higher Than All of 2024</li>
</ul>


Faraday Top-Line Soars on CoWoS Chip Packaging Services Support Ramp -- 78% of MP Revenue Came from AI/HPC Applications
TSMC-Aligned Execution Enables Asset-Light Business Scaling for Faraday -- New Fabless OSAT Service is Highly Differentiated; Competitive Advantage
Outlook: Continued Very Strong Momentum into 2Q25 -- 1H25 Revenue Will Be Higher Than All of 2024


Faraday Technology’s Breakout: AI Packaging Demand Defying the Global Semiconductor Slowdown

TSMC (Taiwan Semiconductor Manufacturing) / Equity Bottom-Up

TSMC (Taiwan Semiconductor Manufacturing) (TSM US)

TSMC (Taiwan Semiconductor Manufacturing)

<ul>
<li>
TSMC’s Arizona fab hits Taiwan-level yields, easing replication concerns and reinforcing its global leadership across N2 and advanced packaging. </li>
<li>
AI demand offsets smartphone softness in 1Q25; TSMC guides +13% QoQ revenue for 2Q25 as margins hold firm despite tariff and earthquake headwinds. </li>
<li>
Faraday and UMC results ahead this week -- Key readouts on Taiwan’s ASIC, mature node, and design service momentum amid U.S.-China tech decoupling.</li>
</ul>



TSMC’s Arizona fab hits Taiwan-level yields, easing replication concerns and reinforcing its global leadership across N2 and advanced packaging. 

AI demand offsets smartphone softness in 1Q25; TSMC guides +13% QoQ revenue for 2Q25 as margins hold firm despite tariff and earthquake headwinds. 

Faraday and UMC results ahead this week -- Key readouts on Taiwan’s ASIC, mature node, and design service momentum amid U.S.-China tech decoupling.


Taiwan Tech Weekly: TSMC U.S. Bet Pays Off; UMC & Faraday Step Up Next; Latest Mobile Shipments Data

<ul>
<li>TSMC Plans 2025E Price Hike of Up to 10% for Advanced Nodes—Exceeding Expectations</li>
<li>MediaTek Poised to Benefit from the ARM and Qualcomm Dispute</li>
<li>Is Splitting Intel Key for Its Survival? Intel Ex-Directors Pen Op-Ed Piece</li>
</ul>


TSMC Plans 2025E Price Hike of Up to 10% for Advanced Nodes—Exceeding Expectations
MediaTek Poised to Benefit from the ARM and Qualcomm Dispute
Is Splitting Intel Key for Its Survival? Intel Ex-Directors Pen Op-Ed Piece


Taiwan Tech Weekly: Wave of Earnings Imminent; New TSMC Price Hike; Mediatek Winner of QCOM/ARM Spat

Taiwan

Faraday Technology Corp. designs and manufactures application specific integrated circuits (ASICs) and wafers.

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Faraday Technology (3035 TT)

Quiddity Leaderboard T50/100 Sep25: Tung Ho Steel TDIV Deletion Gets Closer than Before

Tung Ho Steel (2006 TT) will need to underperform other names by 13% to be an unconditional T100 DEL and get deleted from TDIV. However, there are...

Janaghan Jeyakumar, CFA

TWSE Short Interest Weekly (May 2nd): Winbond Electronics, China Motor, Ap Memory Technology

We analyzed TWSE short interest report for the past week and highlighted short interest changes in Winbond Electronics, China Motor, Ap Memory...

Ke Yan, CFA, FRM

Faraday Technology’s Breakout: AI Packaging Demand Defying the Global Semiconductor Slowdown

Faraday's top-line growth driven by CoWoS chip packaging services for AI/HPC applications, with very strong momentum expected to continue into 2Q25.

Vincent Fernando, CFA

Taiwan Tech Weekly: TSMC U.S. Bet Pays Off; UMC & Faraday Step Up Next; Latest Mobile Shipments Data

TSMC's Arizona fab achieves Taiwan-level yields, reinforcing global leadership in N2 and advanced packaging, while AI demand offsets smartphone...

Vincent Fernando, CFA

Taiwan Tech Weekly: Wave of Earnings Imminent; New TSMC Price Hike; Mediatek Winner of QCOM/ARM Spat

TSMC to raise prices even higher, MediaTek to benefit from ARM and Qualcomm dispute, former Intel directors suggest splitting Intel for survival.

Vincent Fernando, CFA

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Quiddity Leaderboard T50/​​​100 Sep25: Tung Ho Steel TDIV Deletion Gets Closer than Before

Tung Ho Steel (2006 TT) will need to underperform other names by 13% to be an unconditional T100 DEL and get deleted from TDIV. However, there are...

Janaghan Jeyakumar, CFA

TWSE Short Interest Weekly (May 2nd): Winbond Electronics, China Motor, Ap Memory Technology

We analyzed TWSE short interest report for the past week and highlighted short interest changes in Winbond Electronics, China Motor, Ap Memory...

Ke Yan, CFA, FRM

Faraday Technology’s Breakout: AI Packaging Demand Defying the Global Semiconductor Slowdown

​Faraday's top-line growth driven by CoWoS chip packaging services for AI/HPC applications, with very strong momentum expected to continue into 2Q25.

Vincent Fernando, CFA

Taiwan Tech Weekly: TSMC U.S. Bet Pays Off; UMC & Faraday Step Up Next; Latest Mobile Shipments Data

​TSMC's Arizona fab achieves Taiwan-level yields, reinforcing global leadership in N2 and advanced packaging, while AI demand offsets smartphone...

Vincent Fernando, CFA

Taiwan Tech Weekly: Wave of Earnings Imminent; New TSMC Price Hike; Mediatek Winner of QCOM/ARM Spat

​TSMC to raise prices even higher, MediaTek to benefit from ARM and Qualcomm dispute, former Intel directors suggest splitting Intel for survival.

Vincent Fernando, CFA

Quiddity Leaderboard T50/100 Sep25: Tung Ho Steel TDIV Deletion Gets Closer than Before

Faraday's top-line growth driven by CoWoS chip packaging services for AI/HPC applications, with very strong momentum expected to continue into 2Q25.

TSMC's Arizona fab achieves Taiwan-level yields, reinforcing global leadership in N2 and advanced packaging, while AI demand offsets smartphone...

TSMC to raise prices even higher, MediaTek to benefit from ARM and Qualcomm dispute, former Intel directors suggest splitting Intel for survival.