Taiwan Tech Focused Senior Analyst

Patrick Liao

Being invited, I joined Sellside, i.e. JPMorgan, Nomura and Macquarie, totally around 9-10 years. Before that, I joined International Data Corp (https://www.idc.com/) to be the Asia Semiconductor analyst for nearly 2 years, and being invited to do personal lectures in TSMC, UMC, Samsung and etc. In my working experiences, I also had the chance to join Taiwanese panel company, AUO (2409.TT) and the buyside, Chinalife (2823.TT), totally for over 1 year.
I obtained MS degree from the Tsing-Hua University. Then I worked in the Taiwan Semiconductor companies for around 11 years. I had several US patents during my stay in the Semiconductor industry.

Being worked in the sellside and buyside, I deeply dived in the Greater China Semiconductor industry and directly covered some companies, like TSMC (2330.TT, TSM.US), UMC (2303.TT, UMC.US), Vanguard (5347.TT), ASE (3711.TT, ASX.US), SPIL (merged with ASE and delisted), KYEC ( 2449.TT), JCET (600584.CH), ASMPT (522.HK), GWC (6488.TT), WinSemi (3105.TT), Mediatek (2454.TT), Silergy (6415.TT), Novatek (3034.TT), Guoxin Micro (002049.CH) etc.

TSMC (2330.TT; TSM.US): 1Q26 with EPS of NT$22.1, with Full-Year USD Revenue Growth Over 30%.

TWSE Foreign Holding Weekly (Apr 10th): TSMC, Quanta Computer, Delta Electronics, Yageo, Wistron

TWSE Foreign Holding Weekly (Apr 2nd): TSMC, Delta Electronics, MediaTek, Hon Hai Precision

Equity Bottom-Up

TSMC (Taiwan Semiconductor Manufacturing) / Equity Bottom-Up

TSMC (Taiwan Semiconductor Manufacturing) (TSM US)

TSMC (Taiwan Semiconductor Manufacturing)

<ul>
<li>Global Expansion &amp; Operations : A total of 18 fabs are currently under construction or expansion worldwide, including 5 advanced packaging facilities.</li>
<li>Advanced Process Roadmap (N2 / A14 / A12): N2 Performance: First-year output is expected to exceed N3’s first year by 45%.</li>
<li>Next-Gen Technology: CFET-based SRAM cell area is 30% smaller than nanosheet designs.</li>
</ul>


Global Expansion &amp; Operations : A total of 18 fabs are currently under construction or expansion worldwide, including 5 advanced packaging facilities.
Advanced Process Roadmap (N2 / A14 / A12): N2 Performance: First-year output is expected to exceed N3’s first year by 45%.
Next-Gen Technology: CFET-based SRAM cell area is 30% smaller than nanosheet designs.


TSMC (2330.TT; TSM.US): 2026 Symposium Held on May 14