ENTITY
Chipbond Technology

Chipbond Technology (6147 TT)

22
Analysis
Information Technology • Taiwan
CHIPBOND Technology Corporation provides chip packaging service for the IC (Integrated Circuit) industry. The Company manufactures Gold Bump, TCP (Tape Carrier Packaging), Solder Bump, and COG (Chip on Glass), which are applied to the process of packaging.
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•18 Dec 2017 16:35

Taiwan Semis - Cash Out in China in Exchange for More Orders and Upgrades

Taiwan semis are cashing out in China: Chipbond announced to sell 53.69% of Chipmore shares to BOE and China government-backed funds for US$166mn....

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•31 Oct 2017 14:25

What Samsung Says About Demand; Implications to Memory, Display, and Smartphone Competitors?

The outlook for memory and foundrySamsung Electronics Co Ltd (005930 KS) expects tight memory supply/demand conditions to continue in 4Q17 due to...

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