At the US-Korea Summit, Samsung’s Next Move Could Reshape the US Chipboard

516 Views25 Aug 2025 16:56

SUMMARY

Samsung has scaled back its Texas fab plans from 44 billion to 37 billion, but the summit may bring a top-up with Intel and Amkor partnerships.
Intel is shifting glass substrate patents to an Arm-like royalty model backed by SoftBank’s 2 billion stake and a 10 percent US government holding.
Samsung's partnership would show alignment with US semiconductor policy at a time when subsidies and political backing matter as much as technology.

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