ENTITY
Chipbond Technology

Chipbond Technology (6147 TT)

22
Analysis
Information Technology • Taiwan
CHIPBOND Technology Corporation provides chip packaging service for the IC (Integrated Circuit) industry. The Company manufactures Gold Bump, TCP (Tape Carrier Packaging), Solder Bump, and COG (Chip on Glass), which are applied to the process of packaging.
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Exchange Announcement • 08 Sep 2026 13:36

The Company Is Invited To The Investment Forum Held By Horizon Securities

Exchange Announcement • 02 Sep 2026 10:52

Clarification Of Media Report

Exchange Announcement • 18 Aug 2026 13:49

To Announce The Registration Of Capital Reduction Due To Cancellation Of The Rsa

Exchange Announcement • 01 Aug 2026 15:07

The Board Approved Increasing Investment In Malaysian Subsidiary (Chipbond Technology Malaysia Sdn. Bhd.)

Exchange Announcement • 30 Jul 2026 19:33

The Company'S Board Of Directors Resolved To Cancel The Reclaimed Employee Restricted Stock Awards And The Associated Paid-In Capital Reduction

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