Refresh
Company Presentation • 27 Mar 2024 10:00
Company Presentation • 06 Sep 2023 14:45
Company Presentation • 08 Jun 2023 10:00
Company Presentation • 02 Mar 2023 13:30
Company Presentation • 11 Sep 2019 09:54
No more presentations
ENTITY
Chipbond Technology (6147 TT)
Chipbond Technology (6147 TT)
14
Analysis
Information Technology • Taiwan
CHIPBOND Technology Corporation provides chip packaging service for the IC (Integrated Circuit) industry. The Company manufactures Gold Bump, TCP (Tape Carrier Packaging), Solder Bump, and COG (Chip on Glass), which are applied to the process of packaging.
more
x