Taiwan Tech Weekly: Packaging Scarcity Locks In to 2030, Intel Builds New Capacity to Compete
TSMC signs 10-year deal, Intel responds with packaging-focused foundry, Taiwan and Korea see growth in memory and passives.
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TWSE Foreign Holding Weekly (Jun 18th): Nanya Technology, Powerchip Semiconductor Manufacturing
We analyzed TWSE foreign holding data for the past week and highlighted foreign holding changes in Nanya Technology, Powerchip Semiconductor...
100 Views
Semiconductors in April: COVID Impact Still Small
The SIA has released April's semiconductor shipment numbers, and they look positive enough. There is still considerable uncertainty both from the...
648 Views
Stocks to Work into on March Weakness
Amazon.com Inc (AMZN US)Microsoft Corp (MSFT US)Samsung Electronics (005930 KS)Samsung SDI Co Ltd (006405 KS)Larsen & Toubro (LT IN)ICICI Bank...
496 Views
TWSE Foreign Holding Weekly (Jun 12th): TSMC, MediaTek, Yageo, Quanta Computer, Delta Electronics
We analyzed TWSE foreign holding data for the past week and highlighted foreign holding changes in TSMC, MediaTek, Yageo, Quanta Computer, Delta...
94 Views