In today’s briefing:
- Charge+: Scaling EV Charging Infrastructure from Singapore Across Southeast Asia (Initiation)
- Silicon Box: Scaling Advanced Semiconductor Packaging from Singapore to Europe (Initiation)
Charge+: Scaling EV Charging Infrastructure from Singapore Across Southeast Asia (Initiation)
Executive Summary
- Regional Infrastructure Leadership: Charge+ operates one of the two largest electric vehicle charging networks in Singapore, with over 4,000 points locally and more than 6,000 across Southeast Asia, and is currently executing a cross-border expansion to complete a 5,000-kilometre charging highway to Vietnam. The company leverages proprietary ultra-slim hardware and a centralised smart software platform to secure exclusive, long-term contracts across high-density residential and commercial real estate.
- Favourable Regulatory Tailwinds: The investment case is anchored by state-mandated decarbonisation targets across Southeast Asia, which provide a highly visible and durable demand curve for charging infrastructure. By capturing early market share through strategic partnerships with major property developers and fleet operators, the company establishes high switching costs and secures a captive user base that drives recurring revenue.
- Heavy Capital Intensity Exposure: The business model requires continuous, substantial capital expenditure to manufacture and deploy physical hardware across multiple jurisdictions, structurally constraining near-term profitability and widening pre-tax losses to US$1.6m in FY24. This asset-heavy approach leaves the company highly dependent on external financing rounds and exposes gross margins to volatile wholesale energy prices.
Silicon Box: Scaling Advanced Semiconductor Packaging from Singapore to Europe (Initiation)
- Advanced Packaging Foundry Scale-Up: Silicon Box operates as a dedicated semiconductor packaging provider, transitioning from concept to commercialisation through its US$2.0b manufacturing facility in Singapore. The company leverages proprietary panel-level chiplet integration technology to address critical supply chain bottlenecks, having commenced mass production and secured early enterprise customer shipments within three years of its founding.
- Institutional Capitalisation And Backing: The investment case is anchored by strong capital generation velocity, evidenced by a US$302.5m Series B round that propelled the company to a valuation exceeding US$1.5b. Backed by a syndicate of top-tier institutional investors and corporate venture arms of major semiconductor incumbents, the firm possesses the deep funding capacity and ecosystem integration required to scale its operations globally.
- Capital Intensity and Execution Risk: The fundamentally asset-heavy manufacturing model imposes a heavy depreciation burden and structural margin compression during the ongoing facility ramp-up phase. Any construction delays, equipment supply chain disruptions, or yield degradation across its multibillion-dollar expansion projects in Singapore and Italy will directly threaten liquidity and force dilutive emergency equity raises.

