Daily BriefsECM

Daily Brief ECM: MODEC (6296 JP): The Current Playbook and more

In today’s briefing:

  • MODEC (6296 JP): The Current Playbook
  • Raspberry Pi IPO Preview
  • AUB Group Placement – Good Track Record, Accretive Acquisition


MODEC (6296 JP): The Current Playbook

By Arun George

  • Since the US$535 million secondary placement announcement, Modec Inc (6269 JP)’s shares are down 15% from the undisturbed price of JPY3,320 per share (14 May).
  • Looking at recent large Japanese placements is instructive to understand the potential trading pattern. So far, Modec’s shares have followed the pattern of previous large placements.
  • The offering will likely be priced on 22 May. Investors who have participated in previous large Japanese placements tend to secure positive returns.

Raspberry Pi IPO Preview

By Douglas Kim

  • Established in 2012, Raspberry Pi is getting ready to complete its IPO in London soon. Raspberry Pi provides small, single-board computers. 
  • Raspberry Pi is backed by Sony and ARM Holdings. Nearly 72% of the company’s sales come from commercial customers embedding its products into various consumer devices and other systems. 
  • The company generated sales of US$265.8 million (up 41.5% YoY) and operating profit of US$37.5 million (up 87% YoY) in 2023. 

AUB Group Placement – Good Track Record, Accretive Acquisition

By Sumeet Singh

  • AUB Group Limited (AUB AU) is looking to raise up to AUD200m (US$133m) to fund the acquisition of Pacific Indemnity.
  • The company has a good track record and the deal will be accretive to EPS.
  • In this note, we’ll run the deal through our ECM framework and comment on deal dynamics.

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